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BS EN IEC 60079-11:2024 - TC Tracked Changes. Explosive atmospheres - Equipment protection by intrinsic safety \\\"i\\\", 2024
- 30363233.pdf [Go to Page]
- National foreword [Go to Page]
- Annex ZA (normative)Normative references to international publicationswith their corresponding European publications
- CONTENTS
- FOREWORD
- 1 Scope
- Tables [Go to Page]
- Table 1 – Applicability of specific clauses of IEC 60079-0
- 2 Normative references
- 3 Terms, definitions and abbreviated terms [Go to Page]
- 3.1 Terms and definitions
- 3.2 Abbreviated terms
- 4 Equipment grouping, classification and Levels of Protection of apparatus [Go to Page]
- Table 2 – List of abbreviated terms used
- 5 Ignition compliance requirements [Go to Page]
- 5.1 General
- 5.2 Conditions for assessment [Go to Page]
- 5.2.1 General
- 5.2.2 Level of Protection "ia"
- 5.2.3 Level of Protection "ib"
- 5.2.4 Level of Protection "ic"
- 5.2.5 Non-shock hazard equipment or systems
- 5.3 Spark ignition compliance [Go to Page]
- 5.3.1 General
- 5.3.2 Levels of Protection "ia" and "ib"
- 5.3.3 Level of Protection "ic"
- 5.3.4 Application of safety factors
- 5.3.5 Circuits without controlled semiconductor limitation
- 5.3.6 Circuits with controlled semiconductor limitation
- 5.4 Thermal ignition compliance [Go to Page]
- 5.4.1 General
- 5.4.2 Temperature of small components for Group I and Group II
- 5.4.3 Wiring within intrinsically safe apparatus for Group I and Group II
- 5.4.4 PCB tracks for Group I and Group II
- Table 3 – Temperature classification of copper wiringfor ambient temperature ≤ 40 °C
- Table 4 – Temperature classification of tracks on PCBs [Go to Page]
- 5.4.5 Intrinsically safe apparatus and component temperature for dusts
- 5.5 Simple apparatus
- Table 5 – Maximum permitted power dissipation within a component immersed in dust
- 6 Apparatus construction [Go to Page]
- 6.1 General
- 6.2 Enclosures [Go to Page]
- 6.2.1 General
- 6.2.2 Apparatus complying with Table 7
- 6.2.3 Apparatus complying with Table 8 or Table 9
- 6.2.4 Enclosures for Group IIIC intrinsically safe apparatus
- 6.2.5 Protection of separations
- 6.3 Connection facilities for external circuits [Go to Page]
- 6.3.1 Terminals
- Figures [Go to Page]
- Figure 1 – Separation at terminals [Go to Page]
- 6.3.2 Earth Terminals
- 6.3.3 Plugs and sockets
- 6.3.4 Permanently connected cable
- 6.3.5 Connections and accessories for intrinsically safe apparatus for use in non-hazardous area
- 6.4 Internal connections and connectors [Go to Page]
- 6.4.1 General
- 6.4.2 Infallible connections
- Figure 2 – Examples of independent and non-independent connecting elements [Go to Page]
- 6.4.3 Connectors for internal connections, plug-in cards and components
- 6.4.4 Earth conductors and connections
- Table 6 – Requirements for infallible circuit board tracks and vias
- 6.5 Separation of conductive parts [Go to Page]
- 6.5.1 Separations on which intrinsic safety depends
- 6.5.2 Separation distances according to Table 7
- 6.5.3 Reduced separation distances
- 6.5.4 Failure of separations
- Table 7 – Clearances, creepage distances and separations
- Table 8 – Reduced separations
- Table 9 – Reduced separations for Level of Protection "ic"
- Figure 3 – Example of separation of conductive parts [Go to Page]
- 6.5.5 Voltage between conductive parts
- 6.5.6 Types of separation
- Table 10 – Creepage distance and clearance X in Figure 4
- Figure 4 – Determination of creepage distances and clearance [Go to Page]
- 6.5.7 Composite separations
- 6.5.8 Printed circuit board assemblies
- Figure 5 – Creepage distances and clearances on PCBAs [Go to Page]
- 6.5.9 Separation by metal parts
- 6.5.10 Separation by non-metallic insulating partitions
- 6.5.11 Insulation of internal wiring
- 6.6 Encapsulation [Go to Page]
- 6.6.1 General
- 6.6.2 Encapsulation used for the exclusion of explosive atmospheres
- Figure 6 – Encapsulation used without a separate external enclosure
- Figure 7 – Complete enclosure with no user removable covers or openings
- Figure 8 – Enclosure where the compound forms one of the external walls
- Figure 9 – Enclosure with cover [Go to Page]
- 6.6.3 Mechanical protection to avoid access to parts
- Figure 10 – Moulding over un-mounted components
- Figure 11 – Moulding over components mounted on a PCB [Go to Page]
- 6.6.4 Encapsulation used for protection of a fuse
- 6.6.5 Encapsulation used to provide separation
- 6.6.6 Encapsulation used to enhance the rating of protective components
- 6.6.7 Free space within the encapsulation
- Table 11 – Minimum thickness of compound adjacentto individual free space for Group I and Group II
- Table 12 – Minimum thickness of compound adjacentto individual free space for Group III
- 6.7 Specification of coating, encapsulation materials
- 6.8 Protection against polarity reversal
- 6.9 Dielectric strength requirement
- 7 Characteristics and failure of components and assemblies [Go to Page]
- 7.1 Rating of components on which intrinsic safety depends
- 7.2 Failure of components
- 7.3 Manufacturing variation
- 7.4 Resistors [Go to Page]
- 7.4.1 General
- 7.4.2 Resistors on which intrinsic safety depends
- Table 13 – Rating and failure modes of resistors
- 7.5 Capacitors [Go to Page]
- 7.5.1 General
- 7.5.2 Capacitors on which intrinsic safety depends
- 7.5.3 Blocking capacitors
- 7.5.4 Infallible filter capacitors
- Table 14 – Rating and failure modes of capacitors
- 7.6 Inductors and windings [Go to Page]
- 7.6.1 General
- 7.6.2 Inductors on which intrinsic safety depends
- 7.6.3 Infallibly insulated inductors
- Table 15 – Rating and failure modes of inductors [Go to Page]
- 7.6.4 Damping windings
- 7.6.5 Common mode choke coils (EMI suppression filters)
- 7.7 Semiconductors [Go to Page]
- 7.7.1 Failure of semiconductors
- 7.7.2 Semiconductors on which intrinsic safety depends
- 7.7.3 Transient effects on semiconductors on which intrinsic safety depends
- 7.7.4 Semiconductors in shunt voltage limiters
- Table 16 – Rating and failure modes of semiconductors [Go to Page]
- 7.7.5 Shunt assembly on which intrinsic safety depends
- 7.7.6 Safety assemblies infallible against failure to limit voltage
- 7.7.7 Semiconductor current limiters
- 7.7.8 Use of programmable components
- 7.8 Transformers [Go to Page]
- 7.8.1 General
- 7.8.2 Transformers on which intrinsic safety depends
- 7.8.3 Construction of transformers on which intrinsic safety depends
- 7.8.4 Protective measures for transformers on which intrinsic safety depends for Levels of Protection "ia" and "ib"
- Table 17 – Minimum foil thickness or minimum wire diameter of the screen [Go to Page]
- 7.8.5 Requirements for transformers for Level of Protection "ic"
- 7.9 Relays [Go to Page]
- 7.9.1 General
- 7.9.2 Relays on which intrinsic safety depends
- 7.10 Signal isolators [Go to Page]
- 7.10.1 General
- 7.10.2 Signal isolators on which intrinsic safety depends
- Table 18 – Rating and failure modes of signal isolators [Go to Page]
- 7.10.3 Signal isolators between intrinsically safe and non-intrinsically safe circuits
- 7.10.4 Signal isolators between separate intrinsically safe circuits
- 7.11 Fuses
- 7.12 Primary and secondary cells and batteries [Go to Page]
- 7.12.1 General
- 7.12.2 Construction of cells and batteries used in intrinsically safe apparatus
- 7.12.3 Electrolyte leakage
- 7.12.4 Ventilation
- 7.12.5 Cell voltages
- 7.12.6 Batteries in equipment protected by different Types of Protection
- 7.12.7 Batteries used and replaced in explosive atmospheres
- 7.12.8 Replaceable batteries used but not replaced in explosive atmospheres
- 7.12.9 External contacts for charging batteries
- 7.13 Piezoelectric devices
- 7.14 Cells for the detection of gases [Go to Page]
- 7.14.1 Electrochemical
- 7.14.2 Catalytic
- 7.15 Supercapacitors
- 7.16 Thermal devices [Go to Page]
- 7.16.1 General
- 7.16.2 Thermal devices used to limit temperature
- Table 19 – Rating and failure modes of temperature sensors [Go to Page]
- 7.16.3 PPTC devices used to limit current
- Table 20 – Rating and failure modes of switching thermal devices
- Table 21 – Rating and failure modes of PTC devices used to limit temperature
- Table 22 – Rating and failure modes of PPTC devices used to limit current
- 7.17 Mechanical switches
- 8 Supplementary requirements for specific apparatus [Go to Page]
- 8.1 Diode safety barriers [Go to Page]
- 8.1.1 General
- 8.1.2 Construction
- 8.2 FISCO apparatus
- 9 Type verifications and type tests [Go to Page]
- 9.1 Spark ignition test [Go to Page]
- 9.1.1 General
- 9.1.2 Spark test apparatus and its use
- 9.1.3 Test gas mixtures and spark test apparatus calibration current
- Table 23 – Compositions of explosive test mixtures adequate for 1,0 safety factor
- Table 24 – Compositions of explosive test mixtures adequate for 1,5 safety factor
- 9.2 Spark ignition assessment using reference curves and tables [Go to Page]
- 9.2.1 General
- 9.2.2 Assessment of simple resistive circuit
- Figure 12 – Example of a simple resistive circuit [Go to Page]
- 9.2.3 Assessment of simple capacitive circuits
- Figure 13 – Example of simple capacitive circuit
- Figure 14 – Effective capacitance [Go to Page]
- 9.2.4 Assessment of Simple Inductive Circuits
- Figure 15 – Example of simple inductive circuit
- Table 25 – Permitted reduction of effective capacitancewhen protected by a series resistance [Go to Page]
- 9.2.5 Determination of Lo/Ro for resistance limited power source
- 9.2.6 Circuits with both inductance and capacitance
- 9.3 Temperature tests
- 9.4 Mechanical tests [Go to Page]
- 9.4.1 Casting compound
- 9.4.2 Acceptability of encapsulated or coated fuses
- 9.4.3 Partitions
- 9.4.4 Cable pull test
- 9.5 Current carrying capacity of infallible printed circuit board connections
- 9.6 Dielectric strength tests
- 9.7 Qualification of solid insulation and distance through casting compound for application of reduced separations [Go to Page]
- 9.7.1 General
- 9.7.2 Preconditioning
- 9.7.3 AC power frequency voltage test
- 9.7.4 Partial discharge test
- 9.8 Type tests for PCB coatings
- 9.9 Differential Leakage current tests for signal isolators
- Figure 16 – Test voltages
- 9.10 Isolator tests [Go to Page]
- 9.10.1 General
- 9.10.2 Thermal conditioning and dielectric test
- Figure 17 – Recommended bias circuit for Differential Leakage measurement [Go to Page]
- 9.10.3 Dielectric and short circuit test
- 9.11 Tests for intrinsically safe apparatus containing piezoelectric devices
- 9.12 Tests for PTC devices
- 9.13 Determination of parameters of loosely specified components
- 9.14 Tests for cells, batteries and supercapacitors [Go to Page]
- 9.14.1 Conditions for testing
- 9.14.2 Electrolyte leakage test for cells, batteries and supercapacitors
- 9.14.3 Spark ignition and surface temperature of cells, batteries or supercapacitors
- 9.14.4 Battery container pressure tests
- 9.14.5 Battery resistance
- 9.15 Determination of storable energy in common mode chokes
- Figure 18 – Inductor test circuit
- 9.16 Type tests for components protected by time dependent current limitation
- Figure 19 – Measured oscillation
- 9.17 Transformer tests [Go to Page]
- 9.17.1 General
- 9.17.2 Mains transformers for Level of Protection "ia" and "ib"
- 9.17.3 Transformers galvanically isolated from the mains supply for Levels of Protection "ia" and "ib"
- 9.17.4 Transformers for Level of Protection "ic"
- 10 Routine verifications and tests [Go to Page]
- 10.1 Alternative reduced spacings
- 10.2 Routine tests for diode safety barriers [Go to Page]
- 10.2.1 Completed barriers
- 10.2.2 Diodes for 2-diode "ia" barriers
- 10.3 Routine tests for transformers [Go to Page]
- 10.3.1 Levels of Protection "ia" and "ib"
- 10.3.2 Level of Protection "ic"
- 10.4 Routine verification of conformal coating and encapsulation
- Table 26 – Routine test voltages for transformers
- 11 Marking [Go to Page]
- 11.1 Intrinsically safe apparatus and associated apparatus [Go to Page]
- 11.1.1 General
- 11.1.2 Intrinsic safety parameters
- 11.1.3 FISCO
- 11.1.4 Marking of connection facilities
- 11.1.5 Non-hazardous area accessory
- 11.2 Warning markings
- Table 27 – Text of warning markings
- 12 Instructions [Go to Page]
- 12.1 General
- 12.2 Specific Conditions of Use
- Table 28 – Concerns addressed by Specific Conditions of Use
- Annex A (normative)Spark ignition reference curves [Go to Page]
- Figure A.1 – Resistive circuits
- Figure A.2 – Group I capacitive circuits
- Figure A.3 – Group II capacitive circuits
- Figure A.4 – Inductive circuits of Group II
- Figure A.5 – Group I inductive circuits
- Figure A.6 – Group IIC inductive circuits
- Table A.1 – Permitted short circuit current correspondingto the voltage and the equipment group
- Table A.2 – Permitted capacitance corresponding to the voltageand the equipment group
- Annex B (normative)Spark test apparatus for intrinsically safe circuits [Go to Page]
- B.1 Principle
- B.2 Spark test apparatus
- B.3 Spark test apparatus sensitivity
- B.4 Preparation and cleaning of tungsten wires
- B.5 Conditioning a new cadmium disc
- B.6 Limitations of the spark test apparatus
- B.7 Modification of spark test apparatus for use at higher currents
- Figure B.1 – Spark test apparatus for intrinsically safe circuits
- Figure B.2 – Cadmium contact disc
- Figure B.3 – Wire holder
- Figure B.4 – Example of a practical design of spark test apparatus
- Figure B.5 – Arrangement for fusing tungsten wires
- Annex C (informative)Measurement of creepage distances, clearances and separation distances through casting compound and through solid insulation [Go to Page]
- C.1 Clearances and separation distances through casting compound andthrough solid insulation
- Figure C.1 – Measurement of clearance
- Figure C.2 – Measurement of composite distances
- C.2 Creepage distances
- Figure C.3 – Measurement of creepage
- C.3 Examples for the application of an ambient pressure correction factor
- Figure C.4 – Composite separation including creepage
- Figure C.5 – PCB with two coated components designedfor ambient pressure 60 kPa to 110 kPa
- Figure C.6 – PCB with 3 mm slot designed for ambient pressure 60 kPa to 110 kPa
- Annex D (normative)Excess transient energy test [Go to Page]
- D.1 Overview
- Table D.1 – Energy limits by equipment group
- D.2 Circuit configuration
- Figure D.1 – Example circuit configuration
- D.3 Test equipment
- D.4 Test load
- D.5 Supply voltage
- D.6 Supply change tests
- D.7 Load change tests
- D.8 Transient energy calculation
- Figure D.2 – Example output voltage, current, power and energy measuredduring a load transient
- Annex E (normative)FISCO – Apparatus requirements [Go to Page]
- E.1 Overview
- E.2 Apparatus requirements [Go to Page]
- E.2.1 General
- E.2.2 FISCO power supplies
- E.3 FISCO field devices [Go to Page]
- E.3.1 General
- Table E.1 – Assessment of maximum output current for usewith "ia" and "ib" FISCO rectangular supplies
- Table E.2 – Assessment of maximum output current for use with "ic" FISCO rectangular supplies [Go to Page]
- E.3.2 Additional requirements of "ia" and "ib" FISCO field devices
- E.3.3 Additional requirement of "ic" FISCO field devices
- E.3.4 Terminator
- E.3.5 Simple apparatus
- Figure E.1 – Typical FISCO system
- Annex F (normative)Ignition testing of semiconductor limiting power supply circuits [Go to Page]
- F.1 Overview
- F.2 Initial test
- F.3 Subsequent tests
- F.4 Examples of pass and fail
- Table F.1 – Terms used in Annex F
- Table F.2 – Sequence of tests
- Table F.3 – Safety factor provided by several explosive test mixturesthat may be used for the tests in Table F.2
- Table F.4 – Example of a Group I circuit with characteristics described by 'Pr – Table F.4 – PASS' of Figure F.1
- Table F.5 – Example of a Group I circuit with characteristics described by 'Pr – Table F.5 – FAIL' of Figure F.1
- Figure F.1 – Safety factor vs ignition probability
- Annex G (normative)Universal output characteristics [Go to Page]
- G.1 Overview
- G.2 Linear source
- G.3 Non-linear source
- G.4 Curves
- Figure G.1 – Example of an output characteristic for Group IIC
- Figure G.2 – Limit curve diagram for universal source characteristic − Group IIC
- Figure G.3 – Limit curve diagram for universal source characteristic – Group IIB
- Annex H (informative)Examples of marking [Go to Page]
- H.1 General
- H.2 Self-contained intrinsically safe apparatus
- H.3 Intrinsically safe apparatus supplied by other intrinsically safe circuits
- H.4 Associated apparatus
- H.5 Associated apparatus protected by a flameproof enclosure
- H.6 Intrinsically safe apparatus Level of Protection "ic"
- H.7 Intrinsically safe apparatus Level of Protection "ib" with "ia"' outputs
- H.8 FISCO [Go to Page]
- H.8.1 Power supply
- H.8.2 Field device
- H.8.3 Terminator
- H.8.4 Dual marked field device
- Annex I (informative)Overview of tests on enclosures or parts of enclosures [Go to Page]
- Figure I.1 – Tests for enclosures or parts of enclosuresfor separation distances complying with Table 7
- Figure I.2 – Tests for enclosures or parts of enclosures for separation distances complying with Table 8 or Table 9
- Bibliography [Go to Page]