ASTM F542-98
Historical Standard: ASTM F542-98 Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation
SUPERSEDED (see Active link, below)
ASTM F542
1. Scope
1.1 This test method covers a means for measuring the maximum temperature reached in a specific volume by a reacting liquid encapsulating compound, and the time from initial mixing to the time when this peak exothermic temperature is reached.
1.2 This test method measures the potential heat output of an encapsulating compound under conditions that provide no significant heat sink.
1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements see Section 6.
2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.
ASTM Standards
D1711 Terminology Relating to Electrical Insulation
D5423 Specification for Forced-Convection Laboratory Ovens for Evaluation of Electrical Insulation
Keywords
electronic; encapsulating compounds; exothermic temperature; microelectronic encapsulation;
ICS Code
ICS Number Code 31.240 (Mechanical structures for electronic equipment)
DOI: 10.1520/F0542-98
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