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BS EN IEC 60810:2018 Lamps, light sources and led packages for road vehicles. Performance requirements, 2018
- undefined
- Annex ZA(normative)Normative references to international publicationswith their corresponding European publications
- English [Go to Page]
- CONTENTS
- FOREWORD
- 1 Scope
- 2 Normative references
- 3 Terms and definitions
- Figures [Go to Page]
- Figure 1 – Examples of LED packages
- Figure 2 – Example of an LED module without integrated heatsink
- Figure 3 – Example of an LED module with integrated heatsink
- Figure 4 – Example of a replaceable LED light source
- Figure 5 – Example of a non-replaceable LED light source
- 4 Requirements and test conditions for filament lamps [Go to Page]
- 4.1 Basic function and interchangeability
- 4.2 Torsion strength
- 4.3 Characteristic life Tc
- 4.4 Life B3
- 4.5 Luminous flux maintenance
- 4.6 Resistance to vibration and shock
- 4.7 Glass-bulb strength
- 5 Filament lamp data
- Tables [Go to Page]
- Table 1 – Conditions of compliance for life B3
- Table 2 – Conditions of compliance for the vibration test
- Table 3 – Rated life values for continuous operation
- Table 4 – Rated luminous flux-maintenance values for continuous operation
- 6 Requirements and test conditions for discharge lamps [Go to Page]
- 6.1 Basic function and interchangeability
- 6.2 Mechanical strength [Go to Page]
- 6.2.1 Bulb-to-cap connection
- 6.2.2 Cable-to-cap connection (if any)
- 6.3 Characteristic life Tc
- 6.4 Life B3
- 6.5 Luminous flux maintenance
- 6.6 Resistance to vibration and shock
- 6.7 Discharge lamps with integrated starting device
- 6.8 Discharge lamps with integrated starting device and integrated ballast
- 7 Requirements and test conditions for LED light sources [Go to Page]
- 7.1 Basic function and interchangeability
- Figure 6 – Position of the centre of gravity (shaded areas)
- 7.2 UV radiation
- 7.3 Luminous flux and colour maintenance
- Table 5 – Minimum L70B10 values for replaceable LED light sources
- 7.4 Resistance to vibration and shock
- Table 6 – Typical “on”-times for the different functions per 100 000 km drive distance, based on an average speed of 33,6 km/h a
- Table 7 – Example of product data
- 7.5 Electromagnetic compatibility
- 7.6 Powered thermal cycling test
- Figure 7 – Extract from IEC 60068-2-14 Test Nb, showing the temperature cycle profile
- Table 8 – Temperature classes for the powered thermal cycling test
- 7.7 Mass
- 7.8 Typical circuits for LED light sources [Go to Page]
- 7.8.1 General
- 7.8.2 Typical circuits for LR3, LR5, LY3, LY5, LW3 and LW5 LED light sources
- Table 9 – Maximum mass for LED light sources [Go to Page]
- 7.8.3 Typical circuits for LR4 LED light sources
- Figure 8 – Typical electrical circuit for an LR3, LR5, LY3, LY5, LW3 and LW5 LED light source
- Figure 9 – Typical electrical circuit for an LR4 LED light source
- 7.9 Maximum power consumption
- 7.10 Overvoltage test
- 7.11 Reverse voltage test
- Table 10 – Maximum power consumption
- 7.12 Transient voltage test (field decay)
- Figure 10 – Profile of pulse 1 from ISO 7637-2
- Table 11 – Test parameters for pulse 1 from ISO 7637-2
- 7.13 Transient voltage test (load dump)
- Figure 11 – Profile of pulse 2a from ISO 7637-2
- Table 12 – Test parameters for pulse 2a from ISO 7637-2
- 7.14 Electrostatic discharge test (ESD)
- 7.15 Pulsed operating life (PLT) test
- 8 Requirements and test conditions for LED packages [Go to Page]
- 8.1 LED package stress test qualification
- 8.2 Test samples [Go to Page]
- 8.2.1 Lot requirements
- 8.2.2 Production requirements
- 8.2.3 Pre- and post-stress test requirements
- 8.2.4 Assembly of LED packages on test boards
- 8.2.5 Moisture pre-conditioning (MP)
- 8.2.6 Thermal resistance (TR) test
- 8.3 Definition of failure criteria
- 8.4 Choice between test conditions
- 8.5 Criteria for passing qualification/requalification
- 8.6 Qualification test [Go to Page]
- 8.6.1 Pre- and post- electrical and photometric test
- 8.6.2 Pre- and post- external visual (EV) test
- 8.6.3 High temperature operating life (HTOL) test
- 8.6.4 Temperature cycling (TMCL) test
- 8.6.5 Wet high temperature operating life (WHTOL) test
- 8.6.6 Power temperature cycling (PTMCL) test
- 8.6.7 Electrostatic discharge, human body model (ESD-HBM) test
- 8.6.8 Electrostatic discharge, machine model (ESD-MM) test
- 8.6.9 Destructive physical analysis (DPA) test
- 8.6.10 Physical dimensions (PD) test
- 8.6.11 Vibrations variable frequency (VVF) test
- 8.6.12 Mechanical shock (MS) test
- 8.6.13 Resistance to soldering heat (RSH-TTW) test
- 8.6.14 Resistance to soldering heat (RSH-reflow) test
- 8.6.15 Solderability (SO) test
- 8.6.16 Thermal shock (TMSK) test
- 8.6.17 Hydrogen sulphide (H2S) test
- 8.6.18 Pulsed operating life (PLT) test
- 8.6.19 Dew (DEW) test
- 8.6.20 Flowing mixed gas corrosion (FMGC) test
- 8.6.21 Wire bond pull test (WBP)
- Figure 12 – Temperature–humidity characteristics for the DEW test [Go to Page]
- 8.6.22 Bond shear test (BS)
- 8.6.23 Die shear test (DS)
- Annexes [Go to Page]
- Annex A (normative) Life test conditions for filament lamps [Go to Page]
- A.1 Ageing
- A.2 Test voltage
- A.3 Operating position and operating conditions
- A.4 Switching cycle [Go to Page]
- A.4.1 Single-filament lamps
- A.4.2 Dual-filament lamps for headlamps
- A.4.3 Dual-filament lamps for light signalling equipment
- A.5 Luminous flux and colour maintenance
- Annex B (normative) Vibration tests [Go to Page]
- B.1 General
- B.2 Test conditions [Go to Page]
- B.2.1 General
- B.2.2 Mounting (see IEC 60068-2-47)
- B.2.3 Measuring points
- B.2.4 Control point
- B.2.5 Conditioning
- B.2.6 Axis of vibration
- B.2.7 WBR test – Basic motion
- B.3 Test conditions [Go to Page]
- B.3.1 General
- B.3.2 Narrowband random vibration tests
- Table B.1 – Vibration test on motor vehicle lamps –Test conditions
- Table B.2 – Vibration test on motor vehicle lamps (Standard test conditions (narrowband) [Go to Page]
- [Go to Page]
- B.3.3 Wideband random vibration tests
- Table B.3 – Vibration test on motor vehicle lamps ( Heavy-duty test conditions
- Table B.4 – Vibration test on motor vehicle lamps – Standard test conditions (wideband)
- Figure B.1 – Recommended equipment layout for vibration testing
- Annex C (normative) Glass-bulb strength test [Go to Page]
- C.1 General
- C.2 Test equipment and procedure [Go to Page]
- C.2.1 Principle of the test equipment
- C.2.2 Test conditions
- Figure C.1 – Diagrammatic sketch of the principle of the test equipment [Go to Page]
- [Go to Page]
- C.2.3 Requirements for plates
- C.3 Requirements
- Table C.1 – Compression strength [Go to Page]
- C.4 Evaluation [Go to Page]
- C.4.1 General
- C.4.2 Assessment based on attributes
- C.4.3 Assessment based on variables
- Table C.2 – Inspection by attributes – Double sampling plan
- Table C.3 – Inspection by variables – "S" method of assessment
- Annex D (normative) Life and luminous flux maintenance test conditions for discharge lamps [Go to Page]
- D.1 Ageing
- D.2 Test circuit and test voltage
- D.3 Burning position and operating conditions
- D.4 Switching cycle
- Table D.1 – On/off switching cycle
- Figure D.1 – Superposition of on/off switchingand power switching cycle
- Table D.2 – Power switching cycle [Go to Page]
- D.5 Luminous flux maintenance
- Table D.3 – Fast power switching cycle
- Annex E (normative) Bulb deflection test [Go to Page]
- E.1 General
- E.2 Test set-up and procedure
- E.3 Requirement
- Figure E.1 – Sketch of the test set-up
- Annex F (informative) Guidance on equipment design [Go to Page]
- F.1 Pinch temperature limit
- F.2 Solder temperature limit
- F.3 Maximum filament lamp outline
- F.4 Maximum surge voltage
- F.5 Recommended instructions for use and handling of halogen filament lamps
- F.6 Recommended instructions for use and handling of discharge lamps
- Figure F.1 – Voltage surges for 12 V filament lamps –Maximum tolerable duration for a voltage surge as a function of its height
- Figure F.2 – Maximum filament lamp outlines H1
- Figure F.3 – Maximum filament lamp outlines H2
- Figure F.4 – Maximum filament lamp outlines H3
- Figure F.5 – Maximum filament lamp outlines P21W, PY21W,P21/4W and P21/5W
- Annex G (informative) Ballast design
- Table G.1 – Open circuit voltage
- Annex H (informative) Symbols [Go to Page]
- H.1 General
- H.2 Symbol indicating that lamps operate at high temperatures
- H.3 Symbol indicating that care should be taken to avoid touching the bulb
- H.4 Symbol indicating that the use of protective gloves is advised
- H.5 Symbol indicating that lamps with scratched or otherwise damaged bulbs should not be used
- H.6 Symbol indicating that before handling, the lamp shall be switched off
- H.7 Symbol indicating that the use of eye protection is advised
- H.8 Symbol indicating that during operation, the lamp emits UV-radiation
- H.9 Symbol indicating that the lamp shall be operated only in a luminaire with a protective shield
- H.10 Symbol indicating dangerous voltage
- H.11 Pictogram for instruction "Non-ECE"
- Figure H.1 – Pictogram for instruction "Non-ECE" [Go to Page]
- H.12 Pictogram for instruction "Interior lighting only"
- Figure H.2 – Pictogram for instruction "Interior lighting only"
- Annex I (normative) Luminous flux maintenance test conditions for LED light sources [Go to Page]
- I.1 Ageing
- I.2 Test voltage
- I.3 Operating conditions [Go to Page]
- I.3.1 Test rack
- I.3.2 LED light sources with integrated thermal management
- I.3.3 LED light sources with external thermal management
- I.4 Switching cycle [Go to Page]
- I.4.1 Single-function LED light sources
- I.4.2 Dual-function LED light sources for headlamps
- I.4.3 Multiple-function LED light sources for light signalling equipment
- Table I.1 – Examples of possible product data [Go to Page]
- I.5 Luminous flux maintenance measurements
- I.6 Colour measurement
- Annex J (normative) Destructive physical analysis for LED packages [Go to Page]
- J.1 Description
- J.2 Equipment
- J.3 Procedure
- J.4 Failure criteria
- Annex K (informative) Communication sheet LED package testing
- Annex L (normative) Re-testing matrix for LED packages testing
- Annex M (informative) Guidelines for LED packages robustness validation [Go to Page]
- M.1 General
- Figure M.1 – Concept of over-stress testing for two stress parameters [Go to Page]
- M.2 Test samples [Go to Page]
- M.2.1 Lot requirements
- Figure M.2 – Flow diagram for the robustness validation process [Go to Page]
- [Go to Page]
- M.2.2 Production requirements
- M.2.3 Pre- and post-stress test requirements
- M.2.4 Assembly of LED packages on test boards
- M.3 Definition of end-of-test criteria
- M.4 Test sequence of over-stress testing
- M.5 Over-stress test definition [Go to Page]
- M.5.1 Pre- and post-electrical and photometric test
- M.5.2 Pre- and post-external visual (EV) test
- M.5.3 High temperature operating life (HTOL) and low temperature operating life (LTOL) tests
- Table M.1 – Typical over-stress matrix for two stress parameters [Go to Page]
- [Go to Page]
- M.5.4 Temperature cycling (TMCL) test
- M.5.5 Wet high temperature operating life (WHTOL) test
- M.5.6 Power temperature cycling (PTMCL) test
- M.5.7 Thermal shock (TMSK) test
- M.6 Destructive physical analysis (DPA) test
- M.7 Projection models
- Table M.2 – Acceleration models
- Bibliography [Go to Page]