Cart (0)
- No items in cart.
Total
$0
There is a technical issue about last added item. You can click "Report to us" button to let us know and we resolve the issue and return back to you or you can continue without last item via click to continue button.
Not a subscriber? Register for a trial account.
Already a subscriber? 
MADCAD.com Free Trial
Sign up for a 3 day free trial to explore the MADCAD.com interface, PLUS access the
2009 International Building Code to see how it all works.
If you like to setup a quick demo, let us know at support@madcad.com
or +1 800.798.9296 and we will be happy to schedule a webinar for you.
| Email * | |
| Password * | |
| Confirm * | |
| First Name * | |
| Last Name * | |
| Title | |
| Company Name * | |
| Company Size * | |
| Industry * | |
| Address * | |
| Address 2 | |
| City * | |
| State * |
Zip *
|
| Country * | |
| Phone * | |
| How did you hear about MADCAD.com? * |
|
Reset password
Enter your personal account email address to request
a password reset:
a password reset:
Reset password
Enter your account email address to request
a password reset:
a password reset:
Security check
Please login to your authorized staff account to use this feature.
Are you sure you want to empty the cart?
Report To Us
Contact us for a custom quote
⨯To continue with accurate pricing,
please select your company type below:
⨯We need your input!
Are you a code official in a jurisdiction with less than 300,000 population?
⨯ We need your input!
⨯ We need your input!
⨯We need your input!
Are you an existing Madcad user?
If so, please login to continue with the free items in your cart.
⨯We need your input!
This bundle includes subscribed items.
eLibrary >
IEC 61191-1 Ed. 3.0 b:2018 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies >
IEC 61191-1 Ed. 3.0 b:2018 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies, 2018
- English [Go to Page]
- CONTENTS
- FOREWORD
- 1 Scope
- 2 Normative references
- 3 Terms and definitions
- 4 General requirements [Go to Page]
- 4.1 Order of precedence [Go to Page]
- 4.1.1 General remark
- 4.1.2 Conflict
- 4.1.3 Conformance documentation
- 4.2 Interpretation of requirements
- 4.3 Classification
- 4.4 Defects and process indicators
- 4.5 Process control requirements
- 4.6 Requirements flowdown
- 4.7 Physical designs [Go to Page]
- 4.7.1 New designs
- 4.7.2 Existing designs
- 4.8 Visual aids
- 4.9 Proficiency of personnel [Go to Page]
- 4.9.1 Design proficiency
- 4.9.2 Manufacturing proficiency
- 4.10 Electrostatic discharge (ESD)
- 4.11 Facilities [Go to Page]
- 4.11.1 General
- 4.11.2 Environmental controls
- 4.11.3 Temperature and humidity
- 4.11.4 Lighting
- 4.11.5 Field conditions
- 4.11.6 Clean rooms
- 4.12 Assembly tools and equipment [Go to Page]
- 4.12.1 General
- 4.12.2 Process control
- 5 Requirements of materials [Go to Page]
- 5.1 Overview
- 5.2 Solder
- 5.3 Flux
- 5.4 Solder paste
- 5.5 Preform solder
- 5.6 Adhesives
- 5.7 Cleaning agents [Go to Page]
- 5.7.1 General
- 5.7.2 Cleaning agents selection
- 5.8 Polymeric coatings [Go to Page]
- 5.8.1 Solder resists and localized maskants
- 5.8.2 Conformal coating and encapsulants
- 5.8.3 Spacers (permanent and temporary)
- 5.9 Chemical strippers
- 5.10 Cleaning Agents
- 5.11 Heat shrinkable soldering devices
- 6 Components and printed board requirements [Go to Page]
- 6.1 General
- 6.2 Solderability [Go to Page]
- 6.2.1 Parts solderability
- 6.2.2 Reconditioning
- 6.2.3 Solderability testing of ceramic boards
- 6.3 Solderability maintenance [Go to Page]
- 6.3.1 General
- 6.3.2 Preconditioning
- 6.3.3 Gold embrittlement of solder joints
- 6.3.4 Tinning of non-solderable parts
- 6.4 Solder purity maintenance
- 6.5 Lead preparation [Go to Page]
- 6.5.1 General
- 6.5.2 Lead forming
- 6.5.3 Lead-forming limits
- 7 Assembly process requirements [Go to Page]
- 7.1 Overview
- 7.2 Cleanliness
- 7.3 Part markings and reference designations
- 7.4 Solder connection contours
- 7.5 Moisture traps
- 7.6 Thermal dissipation
- 8 Assembly soldering requirements [Go to Page]
- 8.1 General [Go to Page]
- 8.1.1 Soldering process
- 8.1.2 Machine maintenance
- 8.1.3 Handling of parts
- 8.1.4 Preheating
- 8.1.5 Carriers
- 8.1.6 Hold down of surface mount leads
- 8.1.7 Heat application
- 8.1.8 Cooling
- 8.2 Reflow soldering [Go to Page]
- 8.2.1 Requirements
- 8.2.2 Process development for reflow soldering
- 8.2.3 Flux application
- 8.2.4 Solder application
- 8.3 Manual/hand soldering [Go to Page]
- 8.3.1 Non-reflow manual soldering
- 8.3.2 Reflow manual soldering
- 9 Cleanliness and residue requirements [Go to Page]
- 9.1 General
- 9.2 Qualified cleaning/manufacturing process [Go to Page]
- 9.2.1 General
- 9.2.2 Cleaning designator
- 9.2.3 Upper specification limit
- 9.3 Visual requirements
- 9.4 Correlation of ionic testers
- 9.5 Non-ionic residues
- 9.6 SIR testing
- 10 Assembly requirements [Go to Page]
- 10.1 General
- 10.2 Acceptance requirements [Go to Page]
- 10.2.1 Process control
- 10.2.2 Corrective action limits
- 10.2.3 Control limit determination
- 10.3 General assembly requirements [Go to Page]
- 10.3.1 Assembly integrity
- 10.3.2 Assembly damage
- 10.3.3 Markings
- 10.3.4 Flatness (bow and twist)
- 10.3.5 Solder connection
- 10.3.6 Interfacial connections
- 11 Coating and encapsulation [Go to Page]
- 11.1 Conformal coating [Go to Page]
- 11.1.1 Coating instructions
- 11.1.2 Application
- 11.1.3 Performance requirements
- 11.1.4 Rework of conformal coating
- 11.1.5 Conformal coating inspection
- 11.2 Encapsulation [Go to Page]
- 11.2.1 Encapsulation instructions
- 11.2.2 Application
- 11.2.3 Performance requirements
- 11.2.4 Rework of encapsulant material
- 11.2.5 Encapsulant inspection
- 12 Rework and repair [Go to Page]
- 12.1 Rework of unsatisfactorily soldered electrical and electronic assemblies
- 12.2 Repair
- 12.3 Post rework/repair cleaning
- 13 Product quality assurance [Go to Page]
- 13.1 System requirements
- 13.2 Inspection methodology [Go to Page]
- 13.2.1 Verification inspection
- 13.2.2 Visual inspection
- 13.2.3 Sampling inspection
- 13.3 Process control [Go to Page]
- 13.3.1 System details
- 13.3.2 Defect reduction
- 13.3.3 Variance reduction
- 14 Other requirements [Go to Page]
- 14.1 Health and safety
- 14.2 Special manufacturing requirements [Go to Page]
- 14.2.1 Manufacture of devices incorporating magnetic windings
- 14.2.2 High-frequency applications
- 14.2.3 High-voltage or high-power applications
- 14.3 Guidance on requirement flowdown
- 15 Ordering data
- Annex A (normative) Requirements for soldering tools and equipment [Go to Page]
- A.1 Requirements for tools and equipment
- A.2 Abrasives
- A.3 Benchtop and hand-soldering systems
- A.4 Soldering iron holders
- A.5 Wiping pads
- A.6 Soldering guns
- A.7 Solder pots
- A.8 Process control
- Annex B (normative) Quality assessment [Go to Page]
- B.1 Process control (PC)
- B.2 Reduction of quality conformance testing
- B.3 Audit plan
- Bibliography
- Figures [Go to Page]
- Figure 1 – Solder contact angle
- Figure 2 – Solder wetting of plated through holes without leads
- Figure 3 – Coating conditions
- Tables [Go to Page]
- Table 1 – Solder contamination limits; maximum contaminant limit (percentage by weight)
- Table 2 – Designation of surfaces to be cleaned
- Table 3 – Residue testing for process control
- Table 4 – Maximum acceptable rosin flux residues
- Table 5 – Electrical and electronic assembly defects
- Table 6 – Magnification requirements
- Français [Go to Page]
- SOMMAIRE
- AVANT-PROPOS
- 1 Domaine d’application
- 2 Références normatives
- 3 Termes et définitions
- 4 Exigences générales [Go to Page]
- 4.1 Ordre de priorité [Go to Page]
- 4.1.1 Remarque générale
- 4.1.2 Contradiction
- 4.1.3 Documentation relative à la conformité
- 4.2 Interprétation des exigences
- 4.3 Classification
- 4.4 Défauts et indicateurs de processus
- 4.5 Exigences relatives au contrôle du processus
- 4.6 Transmission des exigences
- 4.7 Conceptions physiques [Go to Page]
- 4.7.1 Conceptions nouvelles
- 4.7.2 Conceptions existantes
- 4.8 Aides visuelles
- 4.9 Compétence du personnel [Go to Page]
- 4.9.1 Compétence au niveau de la conception
- 4.9.2 Compétence au niveau de la fabrication
- 4.10 Décharge électrostatique (ESD, ElectroStatic Discharge)
- 4.11 Installations [Go to Page]
- 4.11.1 Généralités
- 4.11.2 Contrôles environnementaux
- 4.11.3 Température et humidité
- 4.11.4 Eclairage
- 4.11.5 Conditions sur le terrain
- 4.11.6 Salles blanches
- 4.12 Outils et matériel d’assemblage [Go to Page]
- 4.12.1 Généralités
- 4.12.2 Contrôle de processus
- 5 Exigences relatives aux matériaux [Go to Page]
- 5.1 Vue d’ensemble
- 5.2 Brasure
- 5.3 Flux
- 5.4 Pâte à braser
- 5.5 Préformes de brasage
- 5.6 Adhésifs
- 5.7 Agents nettoyants [Go to Page]
- 5.7.1 Généralités
- 5.7.2 Choix des agents nettoyants
- 5.8 Revêtements en polymères [Go to Page]
- 5.8.1 Epargnes de brasure et masques localisés
- 5.8.2 Revêtement enrobant et encapsulants
- 5.8.3 Ecarteurs (permanents et temporaires)
- 5.9 Dénudeurs chimiques
- 5.10 Agents nettoyants
- 5.11 Dispositifs de brasage rétractables à la chaleur
- 6 Exigences relatives aux composants et cartes imprimées [Go to Page]
- 6.1 Généralités
- 6.2 Brasabilité [Go to Page]
- 6.2.1 Brasabilité des pièces
- 6.2.2 Reconditionnement
- 6.2.3 Essai de brasabilité des circuits sur substrats céramiques
- 6.3 Maintien de la brasabilité [Go to Page]
- 6.3.1 Généralités
- 6.3.2 Préconditionnement
- 6.3.3 Effritement de la dorure dans les joints brasés
- 6.3.4 Etamage des pièces non brasables
- 6.4 Maintien de la pureté de la brasure
- 6.5 Préparation des sorties [Go to Page]
- 6.5.1 Généralités
- 6.5.2 Formation des sorties
- 6.5.3 Limites de formation des sorties
- 7 Exigences relatives au processus d’assemblage [Go to Page]
- 7.1 Vue d’ensemble
- 7.2 Propreté
- 7.3 Marquages des pièces et désignations de référence
- 7.4 Contours des connexions de brasure
- 7.5 Pièges à humidité
- 7.6 Dissipation thermique
- 8 Exigences relatives au brasage d’un ensemble [Go to Page]
- 8.1 Généralités [Go to Page]
- 8.1.1 Processus de brasure
- 8.1.2 Entretien de la machine
- 8.1.3 Manipulation des pièces
- 8.1.4 Préchauffage
- 8.1.5 Supports
- 8.1.6 Maintien en position basse des sorties de montage en surface
- 8.1.7 Application de chaleur
- 8.1.8 Refroidissement
- 8.2 Brasage par refusion [Go to Page]
- 8.2.1 Exigences
- 8.2.2 Développement du processus pour le brasage par refusion
- 8.2.3 Application du flux
- 8.2.4 Application de la brasure
- 8.3 Brasage manuel [Go to Page]
- 8.3.1 Brasage manuel sans refusion
- 8.3.2 Brasage manuel par refusion
- 9 Exigences relatives à la propreté et aux résidus [Go to Page]
- 9.1 Généralités
- 9.2 Processus de nettoyage/fabrication qualifié [Go to Page]
- 9.2.1 Généralités
- 9.2.2 Désignateur de propreté
- 9.2.3 Limite supérieure de spécification
- 9.3 Exigences visuelles
- 9.4 Corrélation des appareils d’essais ioniques
- 9.5 Résidus non ioniques
- 9.6 Essai de résistance d’isolement de surface
- 10 Exigences relatives à l’ensemble [Go to Page]
- 10.1 Généralités
- 10.2 Exigences relatives à l’acceptation [Go to Page]
- 10.2.1 Contrôle de processus
- 10.2.2 Limites de l’action corrective
- 10.2.3 Détermination de la limite de contrôle
- 10.3 Exigences générales relatives à l’ensemble [Go to Page]
- 10.3.1 Intégrité de l’ensemble
- 10.3.2 Détérioration de l’ensemble
- 10.3.3 Marquage
- 10.3.4 Planéité (courbure et vrillage)
- 10.3.5 Connexion brasée
- 10.3.6 Connexions d’interface
- 11 Revêtement et encapsulation [Go to Page]
- 11.1 Revêtement enrobant [Go to Page]
- 11.1.1 Instructions relatives au revêtement
- 11.1.2 Application
- 11.1.3 Exigences relatives aux performances
- 11.1.4 Retouche du revêtement enrobant
- 11.1.5 Examen du revêtement enrobant
- 11.2 Encapsulation [Go to Page]
- 11.2.1 Instructions relatives à l’encapsulation
- 11.2.2 Application
- 11.2.3 Exigences relatives aux performances
- 11.2.4 Retouche du matériau encapsulant
- 11.2.5 Examen de l’encapsulant
- 12 Retouches et réparations [Go to Page]
- 12.1 Retouche des ensembles électriques et électroniques brasés non satisfaisants
- 12.2 Réparations
- 12.3 Nettoyage après des retouches ou des réparations
- 13 Assurance de la qualité du produit [Go to Page]
- 13.1 Exigences relatives au système
- 13.2 Méthodologie d’examen [Go to Page]
- 13.2.1 Examen de vérification
- 13.2.2 Examen visuel
- 13.2.3 Examen par échantillonnage
- 13.3 Contrôle de processus [Go to Page]
- 13.3.1 Détails relatifs au système
- 13.3.2 Réduction des défauts
- 13.3.3 Réduction de la variance
- 14 Autres exigences [Go to Page]
- 14.1 Santé et sécurité
- 14.2 Exigences spéciales relatives à la fabrication [Go to Page]
- 14.2.1 Fabrication de dispositifs comprenant des enroulements magnétiques
- 14.2.2 Applications à haute fréquence
- 14.2.3 Applications à haute tension et à puissance élevée
- 14.3 Recommandation sur la transmission des exigences
- 15 Données relatives aux commandes
- Annex A (normative) Exigences relatives aux outils et au matériel de brasage [Go to Page]
- A.1 Exigences relatives aux outils et au matériel
- A.2 Abrasifs
- A.3 Appareils de table et autres systèmes de brasage manuel
- A.4 Supports de fer à braser
- A.5 Tampons de nettoyage
- A.6 Pistolets à braser
- A.7 Pots de brasage
- A.8 Contrôle de processus
- Annex B (normative) Evaluation de la qualité [Go to Page]
- B.1 Contrôle de processus
- B.2 Réduction des essais de conformité de la qualité
- B.3 Plan d’audit
- Bibliographie
- Figures [Go to Page]
- Figure 1 – Angle de contact de brasure
- Figure 2 – Mouillage de brasure de trous traversants métallisés sans sorties
- Figure 3 – Conditions de revêtement
- Tableaux [Go to Page]
- Tableau 1 – Limites de contamination de la brasure; limite maximale de contamination(pourcentage en masse)
- Tableau 2 – Désignation des surfaces à nettoyer
- Tableau 3 – Essais sur les résidus pour le contrôle de processus
- Tableau 4 – Niveau maximal autorisé de résidus de flux de résine
- Tableau 5 – Défauts des ensembles électriques et électroniques
- Tableau 6 – Exigences relatives au grossissement [Go to Page]
Copyright 2026 Compu-tecture, Inc.
All Rights Reserved.
About Us /
Careers /
support@madcad.com /
1.800.798.9296